Our Company:

ficonTEC supplies semi-automatic and fully automated production and testing systems, concentrating on the optical industry, laser diode manufacture, optoelectronics, medical technology, security and military engineering and telecommunications.

Learn more about the products, solutions and services of ficonTEC, a worldwide supplier, on these pages. We develop individual automation solutions in microsystems engineering that can increase the efficiency and precision of your production processes.

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ficonTEC is the ideal partner for achieving success in a wide range of applications. We assist you in evaluating existing processes and methods, optimizing and developing innovative processes right through to their implementation. Experienced project teams have the know-how and command over processes, from prototype development to commissioning of complete production lines. ficonTEC covers the assembly technologies bonding, laser welding, soldering, high accuracy active & passive alignment as well as the optical detection and inspection of components. A wide variety of measuring methods are employed. Selected examples of how ficonTEC systems are used can be found under "Solutions".

Product news:

Wafer Anealing with ELIAS

The ficonTEC ELIAS series are machines for annealing of wafer-based and thin-film microelectronic devices. ELIAS stands for Excimer Laser Implant Activation System. Excellent control of material characteristics can be achieved through proper selection of laser parameters. With further downscaling of CMOS structures below the 60 nm node, Excimer lasers – with their unrivalled low pulse-to-pulse energy fluctuation, low coherence and conjugated beam shaping possibilities – have encountered increasing interest from applications in CMOS, PMOS and other related fields. In PMOS front side and backside applications, XeCl radiation at 308 nm has been tested and has found its way into industrial production where the benefits of this technique balance well with the requirements of ever decreasing production costs. The energy density scales with the field size on substrate and can be scaled up to several Joules per square centimetre, enabling melt and non-melt annealing techniques for various applications specifically in the PMOS field.

Any other news can be found in our product information, thank you!