公司：

瑞士喜诺发公司

地址：

Chemin de la Dent d’Oche – 1024 Ecublens – Switzerland

产品范围：

激光精密模板切割系统 - LSS 800/1000/1200
激光划片系统 – LDS 300
激光切割系统 – LCS 150/300
激光边缘磨削系统 – LGS 200

主页：

www.synova.ch

公司简介:

Synova是创新激光切割系统制造商；系统广泛应用于半导体、电子、

汽车、光伏、平板显示器(FPD) 和医疗行业。凭借其专利

之独特Laser MicroJet® (水导激光) 科技，可在多个制程中，

大大提高精度、速度和灵活性。

总部位于瑞士洛桑的Synova公司为私有企业，

在中国、韩国、日本和美国设有

分支机构和微加工中心（MMCs）。

您参加展会的主要目标群体是什么:

参见上述主要目标产业，

主要是需要高精度微加工的产品。

您对产品的描述

运用独特的微水刀激光技术 (发丝般纤细的低压微水柱

通过水/空气界面的全反射，引导激光束），Synova公司专为

超薄模板和金属掩模制造商设计并提供精密模板切割系统，速度极快。

LSS 800 F/1000/1200每秒可切1到10个孔（相当于

每小时加工36’000个孔），且无热损伤、毛刺及氧化。

LSS的机械精度很高，公差小于+/- 5 微米。28微米之极小光束直径几乎能

切割出任意形状的孔。

与传统模板切割中应用的标准激光相反，光纤激光的

脉冲稳定性强，集成度高，确保精确高效，

低电能消耗，而且最重要的是无须维护。

在光电领域（发光二极管，有机发光二极管)，运用激光精密模板切割系统技术，

可快速、洁净地制造超薄金属掩模。切割速度高达每小时30000个孔，

达到无与伦比的切割品质。

激光划片系统(LDS 300)旨在为芯片生产商提供大工作面积的

超高速工具。该系统能切割大到直径300毫米的晶圆，所切割晶粒尺寸小到0.25 x 0.25毫米。

Synova SA

Address:

Chemin de la Dent d’Oche – 1024 Ecublens – Switzerland

Product Range:

Laser Stencil System - LSS 800/1000/1200
Laser Dicing System – LDS 300
Laser Cutting System – LCS 150/300
Laser edge Grinding System – LGS 200

Website:

www.synova.ch

Company profile:

Synova is a manufacturer of innovative laser cutting systems for the semiconductor, electronic,

automotive, photovoltaics, flat panel display (FPD) and medical industries. Through its patented

and unique Laser MicroJet® (water jet-guided laser) technology, it enables accuracy,

speed and flexibility improvements in numerous manufacturing processes.

Headquartered in Lausanne, Switzerland, Synova is a privately held company with

subsidiaries and Micro-Machining Centers (MMCs) located in China, South Korea, Japan,

Taiwan and the United States.

Which are the main target groups for your trade-fair presentation:

See above for major target industries; mainly products requiring high-precision micro-machining

Your product description

Using the unique Laser MicroJet technology (a hair thin, low-pressure water jet guides the

laser beam by means of total internal reflection at the water/air interface), Synova offers a

stencil cutter designed to provide thin stencil and metal mask manufacturers with an "ultra

high speed" tool. The LSS 800 F/1000/1200 cuts from 1 to 10 holes per second (equivalent to

36’000 apertures per hour) without heat damage, burrs, or oxidation.

The LSS offers high mechanical precision with a tolerance of less than +/- 5 μm. Almost any

aperture shape can be created with the very small beam diameter of 28 μm.

Contrary to standard lasers applied in conventional stencil cutting, fiber lasers have high

pulse-to-pulse stability, are very compact, ensure high efficiency, are very robust, have

low consumption of electrical power and, above all, are maintenance-free.

In the photonics industry (LEDs, OLEDs), fast and clean manufacturing of thin metal masks is

now possible using the Laser Stencil System technology. An unparalleled cutting quality is

achieved at rates of up to 30'000 holes per hour.

The Laser Dicing System (LDS 300) is designed to provide chipmakers with an ultra-high-speed

tool with a large working area. It can cut up to 300 mm wafers and dices chips down to 0.25 x 0.25

mm.